Description
Lanrui P08 Explosion-proof Solder Gasket made of high-temperature resistant ultra-white glass can easily tin-plate mobile phone CPU chips without splattering. Lanrui P08 explosion-proof solder gasket effectively prevents uneven solder balls or solder bursting caused by pad oxidation, stencil protrusion, etc., offering strong impact resistance and stability, providing safety protection during the soldering process, and improving mobile phone repair efficiency. Suitable for electronic repair and mobile phone motherboard soldering.
Additional information
| Weight | 50 g |
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