Description
MI12 BGA Reballing Stencil Template For XIAOMI SDX865, BGA153, SDX55M, PM8150B, PM8150A, PM8250, PMX55, WCD9385, 78190-31, 77040, 10 Pro Redmi K30Pro Snapdragon 865 SM8250 CPU RAM Power ADUIO PM IC Chip Stencil
Additional information
| Weight | 10 g |
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