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2UUL BH11 UNIVERSAL MOBLIE PHONE MID LAYER FRAME IC &CPU REBALLING MAGNETIC PLATFORM - Image 1

    2UUL BH11 UNIVERSAL MOBLIE PHONE MID LAYER FRAME IC &CPU REBALLING MAGNETIC PLATFORM

    Original price was: ₹1,000.Current price is: ₹899.

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    SKU: RRT1954 Category: Tags: ,
    Description

    2UUL BH11 UNIVERSAL MOBLIE PHONE MID LAYER FRAME IC &CPU REBALLING MAGNETIC PLATFORM

    Additional information
    Weight 500 g
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