Description
- Fully applicable to various types of chips/motherboards
- Removal tin and glue, no need to adjust the direction, travel coaxial movement
- For iPhone / Android full series IC chip, removal of glue/tin Not blocking the knife
- Motherboard cleaning doesn’t require adjusting the orientation, clean up at once
- The module is suitable for various sizes of motherboards in all aspects
Additional information
| Weight | 250 g |
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